The FabLab is a Class 1000 research cleanroom located in the Jeong H. Kim Engineering Building. The lab supports research and development programs in nano science and technology, micro-electromechanical systems, semiconductors, materials and devices for electronics, bioscience and bioengineering, and sensor/actuator systems. FabLab is open to users from across the university community as well as government and industry.
The FabLab is not only used for work and research. We have a growing number of classes utilizing this state of the art facility giving students hands on experience learning the processes and techniques used to make our electronics and devices.
Cl and F etchers are planned to be shut down for a week from Monday 7/10/2023 to Sunday 7/16/2023 depending on the progress of new gas line installation this week. Keep an eye on the announcements for updates.
External Materials If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made. Please submit an External Materials Request form for each material you will bring. This form can be found on the Fablab equipment page.
Denton e beam system off line due to hi vacuum pump failure.
Dicing saw "A" is back in operation but Dicing saw "B" is not working.
New rates and target limitations are established for AJA ATC Orion 8 Sputtering system. See scheduler reservations for details.
If you run a process that has variable rates (i.e.- ALD, furnace, sputter, etc.), make sure you write in the final dollar amount in the Description of Operation section of your reservation along with the reservation ID number of the original run. Otherwise you will be charged for the full rates.
The NanoCenter and FabLab need your help! Acknowledging the support given by the NanoCenter in your presentations and publications help us out tremendously.
Current hours are:
7:00am - 5:00pm
Monday - Friday
The Main FabLab is open 24/7 with restricted after hours access between 8:00pm - 7:00am.
