| Description |
The Karl Suss MA-4 Mask Aligner is used with substrates up to 4" (100mm) in diameter. It also works for smaller samples. It is a contact/proximity aligner and can be set to utilize either 365 nm or 405 nm light. It is used with a variety of both positive and negative photoresists. Recipes for our standard photoresist processing are attached to the back of the operating instructions below. This system also offers real-time infrared through-wafer backside alignment. |
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| Location | FabLab |
Photo Tunnel
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| Manufacturer |
Karl Suss MA-4 |
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| Staff Contact |
 John Abrahamsjabrah@umd.edu 301-405-5018 |
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| Rates | UMD $75/hr External Non-profit / University $116/hr Small Commercial / MTECH $158/hr Large Commercial $220/hr No Charge $0/hr |
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| Reservations |
Please login to make a reservation. |
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| External Materials |
If you plan to bring external materials into the lab, please notify the FabLab staff to ensure proper safety protocols and any equipment arrangements can be made ahead of your reservation. Please submit an External Materials Request form for each material you will bring. |
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| Logs |
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| SOPs |
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| Manuals
You must have reservation permissions to view the manuals. Please login to view manuals. |
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| Recipes | Photoresist ProcessesAZ4620_process.doc (25.5 KB)NPR9 process.doc (24.5 KB) NR9-1500PY.pdf (88.62 KB) SPR220_resist_process.doc (25.5 KB) baseline_shipley_1813_resist_chlorobenzene_lift.doc (28 KB) chlorobenzene_lift.doc (28.5 KB) photo_resist_pouring_procedure.doc (24 KB) shipley_1813_positive_photolithography_process.doc (27 KB) |
