| Operational Status | ● Online | |||||||||||||||
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| Description |
The Trion RIE is used to remove photoresist residue. Plumbed with O2,CF4,CHF3 and Sf6 the Etcher is an aggressive etcher for any organic material. Can be used to etch thin layers of SiO2 ,SiN and Si |
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| Location | FabLab |
ETCH Tunnel
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| Manufacturer |
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| Staff Contact |
 Mark Lecatesmlecates@umd.edu 301-405-5197 |
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| Rates | UMD $75/hr External Non-profit / University $116/hr Small Commercial / MTECH $158/hr Large Commercial $220/hr No Charge $0/hr |
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| Reservations | No upcoming reservations at this time. | |||||||||||||||
| Logs |
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| SOPs | ||||||||||||||||
| Manuals | You must have lab permissions to view the manuals. Please login to view manuals or contact the lab staff to obtain permissions. |
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| Recipes |
