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File Name Date File Size
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4000-PURE-GOLD-PASTE.pdf 2019-07-10 15:55 29.9K
4171-Cd-FREE-WIRE-BONDABLE-GOLD-PASTE.pdf 2019-07-10 16:05 32.1K
4541-Hole-Plug-Gold-Paste.pdf 2019-07-10 16:22 30.4K
4551-THIN-PRINT-GOLD-PASTE.pdf 2019-07-10 16:28 31.2K
5371-Series-Pb-Free-Capacitor-Dielectric-Pastes.pdf 2019-07-10 11:11 35.6K
5635-Ultra-Low-Temp-Glaze.pdf 2019-07-10 14:52 24.2K
5643W-Sealing-Glaze-for-MEMS.pdf 2019-07-10 14:56 24.6K
5652-Low-Temp-Overglaze-for-AlN.pdf 2019-07-10 08:16 26.9K
5660-Acid-Resistant-Overglaze-For-AlN.pdf 2019-07-10 08:21 38.4K
5671-Low-Temp-Capacitor-Overglaze.pdf 2019-07-10 15:01 25.7K
5672-High-Temp-Capacitor-Overglaze.pdf 2019-07-10 15:05 30.9K
5816-Cross-Over-Dielectric-for-AlN.pdf 2019-07-10 08:53 43.3K
5866-Low-Temp-Cross-Over-Dielectric-Paste.pdf 2019-07-10 11:17 30.4K
6130-Silver-Conductor-for-Thtu-Hole-Edge-Paint.pdf 2019-07-10 17:15 29.5K
6165-SI-Silver-Conductor-for-Silicon-Substrate.pdf 2019-07-10 17:27 29.3K
6296-Silpall-Flash-Solder-Promoting-Paste.pdf 2019-07-11 09:00 28.6K
6331-Silver-1-Pt-Conductor-Paste.pdf 2019-07-11 09:04 41.8K
6716-Silver-for-Plasma.pdf 2019-07-10 17:40 37.3K
AIT-Electrodes-Cross-Reference-Chart.pdf 2019-07-11 14:10 91.2K
AIT-Thermodes-Cross-Reference-Chart.pdf 2019-07-11 14:16 69.7K
Coining-Available-Solder-Alloys.pdf 2019-07-01 11:56 72.8K
Coining-Cover-Assemblies.pdf 2019-07-01 15:14 232.1K
Coining-Leadfree-Alloys.pdf 2019-07-01 11:55 1.3M
Coining-Stamping-Overview.pdf 2020-05-05 13:20 1.1M
Design-Considerations-for-Aluminium-Ribbon-Bonding.pdf 2020-05-05 13:55 1.5M
EGIDE-flyer-OPTO-2017.pdf 2019-07-09 08:55 632.4K
EGIDE-flyer-Power-2017.pdf 2019-07-09 08:27 1.5M
EGIDE-flyer-RF-2017.pdf 2019-07-09 08:36 1.4M
Egide-Products-for-Thermal-Imaging.pdf 2019-07-09 09:03 885.4K
IKB001_THE_GOLD_BALL_BONDING_CYCLE.pdf 2020-05-03 09:24 91.5K
IKB0022_MPP-KnS_NEFO_WAND_SETUP.pdf 2020-06-11 08:43 655.3K
IKB002_THE_FINE_WIRE_WEDGE_BOND_CYCLE.pdf 2020-06-10 09:04 244.8K
IKB003_UNDERSTANDING_WIRE_PULL_TESTING.pdf 2019-07-10 19:11 141.4K
IKB004_BACKUP_DAGE_PARAGON_DATABASE.pdf 2019-07-10 11:03 142.5K
IKB005_GAUGE_RandR_TEST_DAGE_OPTIMA_PLUS.pdf 2020-06-04 13:42 325.0K
IKB006_WORHOLDER_ADJUSTMENT_MPP-KnS.pdf 2020-06-11 08:54 565.4K
IKB007_MPP-KnS_DEEP_ACCESS_CLAMP_ADJUSTMENTS.pdf 2020-06-11 08:08 328.2K
IKB008_MPP-KnS_ADJUSTING_STATIC_BOND_FORCE.pdf 2020-06-10 15:02 454.8K
IKB009_MPP-KnS_ADJUSTING_BOND_FORCE_SETTINGS.pdf 2020-05-03 10:54 332.8K
IKB010_MPP_BONDING_TOOL_NOMENCLATURE.pdf 2020-06-10 09:37 556.1K
IKB012_DUAL_CURING_ADHESIVES.pdf 2019-07-09 23:59 1.7M
IKB014_EXPLANATION_OF_LOW_PRESSURE_PLASMA_CLEANING.pdf 2020-06-08 15:09 873.3K
IKB017_USING_FORMIC_ACID_FOR_OXIDE_REDUCTION.pdf 2020-06-09 11:16 312.1K
IKB018_UNDERSTANDING_BOND_AND_DIE_SHEAR_TESTING.pdf 2020-06-04 14:43 439.3K
IKB021_STANDARD_CLAMP_ADJUSTMENTS.pdf 2020-06-11 08:26 1.1M
IKB023_BONDING_WIRE_HANDLING_CONSIDERATIONS.pdf 2020-06-10 13:06 340.1K
IKB026_MIL_STD_883_DIE_SHEAR_FAILURE_MODES.pdf 2020-06-04 14:58 379.1K
IKB028_DAGE_CREEP_TESTING.pdf 2020-06-04 14:22 335.4K
IKB029_DAGE_FATIGUE_TESTING.pdf 2019-07-10 19:11 152.5K
IKB031_DAGE_HOT_BUMP_TESTING.pdf 2020-06-04 14:33 409.7K
IKB034_WAFER_PROBE_TIP_SELECTION.pdf 2020-06-09 09:31 329.7K
IKB035_HOW_TO_CHOOSE_THE_RIGHT_ADHESIVE.pdf 2020-06-04 13:37 481.9K
IKB036_DICING_BLADE_SELECTION_CRITERIA.pdf 2020-06-05 13:24 730.7K
IKB040_ADHESIVES_FOR_PCBS.pdf 2020-06-22 09:18 306.4K
IKB041_BASIC_ADHESIVE_TYPES.pdf 2019-07-09 23:30 261.4K
IKB042_ADHESIVES_TOTAL_PROCESSING_COSTS.pdf 2020-06-04 13:39 433.0K
Santier-Materials-Spec.pdf 2019-07-09 14:29 925.3K
Santier-Super-CMC-Materials-Specification.pdf 2019-07-09 14:39 426.5K


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