Manufacturing Metalenses for the visible range imparts demanding nanofabrication requirements. To manufacture metalenses and other metastructured devices in volume, Nanoimprint Lithography (NIL) becomes a key enabling technology. Moxtek has used NIL to successfully demonstrate scalability and the ability to reliably replicate metalenses with extremely tight tolerances, including variations in local spacing. By using the NIL […] View document
Moxtek’s Reflective Circular Polarizing BeamSplitter (RCPBS) provides a solution for many innovative optical applications. The Moxtek RCPBS family of products can be used to increase optical path length without increasing physical length, isolate or sample back reflections and other potential applications. View document
Moxtek’s reflective circular polarizing beamsplitter (RCPBS) provides a solution for many innovative optical applications. This paper explores applications where the Moxtek RCPBS family of products can be used to increase optical path length without increasing physical length, filter or sample only light of a specific polarization state, and other potential applications. Read more
MOXTEK has been producing functional nanostructured optical components for over 20 years. We offer high volume wafer replication of various nanostructure devices, including: microlens arrays, waveguides, patterned metasurfaces, Diffractive Optical Elements (DOEs), photonics crystals, and biosensor arrays. These devices are used for imaging, illumination, and display systems for a variety of applications including: automotive, medical/dental […] View document
Moxtek HPC 150W 75kV X-ray tubes are designed to be used in XRF and imaging applications. The tube is designed to be air-cooled and the cooling can be adapted to meet specific needs. The push/pull fan configuration makes it easy to direct the warm air outward. For XRF applications the cone is designed for a […] View document
Nanoimprint Lithography (NIL) has demonstrated the ability to replicate nano-structures within extremely tight tolerances. The process concept and lab sample implementation has been around for a long time. Scaling up has introduced a number of barriers that have taken some time to overcome. In this paper, we discuss the implementation of full wafer NIL in […] View document
